IPC 7711 7721

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IPC 7711/7721 is a set of industry-standard guidelines for the repair and rework of electronic assemblies. The guidelines are published by the IPC, that develops industry standards and best practices for the manufacture and design of electronic products.

Both IPC 7711 and IPC 7721 are widely used in the electronics industry as a reference for repairing and reworking electronic assemblies and PCBAs. They are designed to help ensure that repair and rework processes are carried out in a consistent and reliable manner, resulting in high-quality electronic products.

RECERTIFICATION IPC 7711/7721 CERTIFIED IPC SPECIALIST (CIS)

The IPC-7711/7721 is 4 day intensive course on regulations of the industry standard when it comes to surface-mount component removal and repair procedures, no matter what type of board replacement or rework is required. The module rework guide provides learners with the necessary training to carry out module rework, repair, and modification processes.


Students must be able to demonstrate their knowledge by reworking, repairing and modifying acceptable artistry samples. They can begin with the most basic modules and improve upon their understanding and skills by tackling more difficult modules as they progress.

The training provided by IPC-7711/7721 regulations is essential for any individual who wants to stay up-to-date with the latest technology in the industry. It not only provides them with the necessary theoretical background but also gives them hands-on experience in this field. With this training, students can gain the confidence and strengthen their skills in order to succeed in their respective career paths.


Overall, the IPC-7711/7721 regulations provide comprehensive training that covers all aspects of surface mount component removal and repair procedures. This comprehensive training will ensure that students have a thorough understanding of how to properly handle different types of modules and are well-equipped to provide quality service in the board replacement or surface-mount rework.


For anyone who wishes to renew their IPC certificate and is currently designated as a Certified IPC Specialist with a valid certificate, training on the IPC-7711 and 7721 standards is an essential part of the process. The IPC-7711 standard focuses on reassembling printed circuit boards to their original drawings. This ensures that boards are restored to their original specifications, so that they can continue functioning as intended. On the other hand, the IPC-7721 standard was created for the purpose of restoring a board’s functional competence. This means that panels can be fixed, and their operational capability can be restored.


Therefore, it is important to ensure that any training related to IPC certification focuses on both these standards. The knowledge acquired from these trainings will be useful for anyone certified in IPC standards and will help them in performing repairs and restoring printed circuit boards to their original condition. The training should be comprehensive enough for Certified IPC Specialists to fully understand the intricacies of these standards, so that they can properly perform all types of PCB repairs.

What is IPC 7711/7721?

The IPC 7711/7721 standard covers a wide range of topics related to PCB repair and modification, including techniques for repairing damaged PCBs, procedures for modifying PCBs to correct design errors or improve performance, and guidelines for testing and evaluating repaired and modified PCBs.


The standard also provides guidance on the use of specialized tools and equipment, as well as the selection and use of materials and processes for repair and modification.


IPC 7711/7721 is widely used in the electronics industry and is considered an essential reference for technicians, engineers, and others involved in the repair and modification of PCBs and electronic assemblies. It is regularly updated to ensure that it reflects the latest best practices and technologies in the industry.

Curriculum:

Module 1 – IPC-7711 / 7721C Introduction and Common Procedures (Mandatory)

This compulsory Module contains broad content, which is normally implied to all other section of the IPC-7711/7721C course. To obtain certification to additional knowledge modules, this module must be successful completed before it can be taken.

  • Basic skills required to repair and rework circuit boards
  • Skill levels needed
  • Level of conformance the finished product will need to achieve
  • Common terminology used.


Module 2 Workmanship – Wire Splicing

The workmanship of Wire Splicing requires the basic skills this additional knowledge module contains.

  • The Process of Wire Splicing
  • The Four Most Common Splices Mesh, Wrap, Hook, & Lap
  • Feasibility of Repair
  • Insulated Conductor Stripping
  • Tinning methods
  • Soldering
  • Procedures 8.1.1 – 8.1.4
  • Splice acceptance criteria


Module 3 Workmanship – Conformal Coating

The basic and additional knowledge required for Conformal Coating workmanship is contained in this additional knowledge module.

  • Procedure 2.3.1, Coating Removal, Identification of Conformal Coating
  • Procedure 2.3.2, Coating Removal, Solvent Method
  • Procedure 2.3.3, Coating Removal, Peeling Method
  • Procedure 2.3.4, Coating Removal, Thermal Method
  • Procedure 2.3.5, Coating Removal, Grinding/Scraping Method
  • Procedure 2.3.6, Coating Removal, Micro Blasting Method
  • Procedure 2.4.1, Coating Replacement, Solder Resist
  • Procedure 2.4.2, Coating Replacement, Conformal Coating/ Encapsulants
  • Procedure 2.5, Baking and Preheating


Module 4 Workmanship – Through Hole Components

The basic and additional knowledge required for Through Hole Components workmanship is provided in this additional knowledge module.

  • Procedure 3.1.1, Through-Hole Desoldering, Continuous Vacuum
  • Procedure 3.1.2, Through-Hold Desoldering, Continuous Vacuum – Partial Clinch
  • Procedure 3.1.3, Through-Hole Desoldering, Continuous Vacuum – Full Clinch Procedure
  • 1.4, Through-Hole Desoldering, Full Clinch Straightening
  • Procedure 3.1.3, Through-Hole Desoldering, Full Clinch Wicking
  • Installation of Through-Hole components, Tinning, Lead Forming, Soldering


Module 5 Workmanship – Chip and MELF Components

The basic and additional knowledge required for Chip and MELF Component workmanship is contained in this additional knowledge module.

  • Procedure 3.3.1, Chip Component Removal – Bifurcated Tip
  • Procedure 3.3.2, Chip Component Removal – Tweezer Method
  • Procedure 3.3.3, Chip Component Removal – Hot Air Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 5.3.1, Chip Installation – Solder Paste Method/Hot Air Pencil
  • Procedure 5.3.2, Chip Installation – Point to Point


Module 6 Workmanship – Gull Wing Lead Components

The basic basic and additional workmanship skills required for making Gull Wing Lead Components are contained in this additional knowledge module.

  • Procedure 3.5.1, SOT Removal – Flux Application Method
  • Procedure 3.5.2, SOT Removal – Flux Application Method –Tweezer
  • Procedure 3.5.3, SOT Removal – Hot Air Pencil
  • Procedure 3.6.2, Gull Wing Removal (two-sided) – Solder wrap Method
  • Procedure 3.6.6, Gull Wing Removal (two-sided) – Tweezer
  • Procedure 3.7.1.1, Gull Wing Removal (four-sided) – Bridge Fill Method – Surface Tension
  • Procedure 3.7.7, Gull Wing Removal (four-sided) – Hot Gas
  • Procedure 3.7.1, Gull Wing Removal (four-sided) – Bridge Fill Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 4.4.1, Cleaning SMT Lands – Using Blade Tip and Solder Braid
  • Procedure 4.2.1, Pad Releveling – Using Blade Tip
  • Procedure 4.3.1, SMT Land Tinning – Using the Blade Tip
  • Procedure 5.5.1, Gull Wing Installation – Multi-Lead Method – Top of Lead
  • Procedure 5.5.3, Gull Wing Installation – Point-to-Point Method
  • Procedure 5.5.4, Gull Wing Installation – Hot Air Pencil/Solder Paste Method


Module 7 Workmanship – J-Lead Components

This basic and additional knowledge module provides the foundation skills for the workmanship of J-Lead Components.

  • Procedure 3.8.1.1, J-Lead Removal – Bridge Fill Method – Surface Tension
  • Procedure 3.8.2, J-Lead Removal – Solder Wrap Method – Tweezer
  • Procedure 3.8.3, J-Lead Removal Flux Application Method – Tweezer
  • Procedure 3.8.4, J-Lead Removal – Flux & Tin Tip Only
  • Procedure 3.8.5, J-Lead Removal – Hot Gas Reflow System
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal, Braid Method
  • Procedure 5.6.1, J-Lead Installation – Solder Wire Method
  • Procedure 5.6.2, J-Lead Installation – Point-to-Point
  • Procedure 5.6.3, J-Lead Installation – Solder Paste/Hot Air


Module 9 Workmanship – Laminate Repair

The basic and additional skills required for Laminate Repair are contained in this additional knowledge module.

  • Procedure 3.3.1, Hole Repair, Epoxy Method
  • Procedure 3.3.2 Hole Repair, Transplant Method
  • Procedure 3.5.1, Base Material Repair, Epoxy Method
  • Procedure 2.6, Epoxy Mixing and Handling


Module 10 Workmanship – Circuit Repair

The basic and additional knowledge module provides the necessary knowledge for Circuit Repair workmanship.

  • Procedure 4.2.1, Conductor Repair, Foil Jumper Epoxy Method
  • Procedure 4.2.2, Conductor Repair, Foil Jumper, Film Adhesive Method
  • Procedure 4.7.1, Surface Mount Pad Repair, Epoxy Method
  • Procedure 5.1, Plated Hole Repair, No Inner Layer Connection
  • Procedure 6.1, Jumper Wires
  • Procedure 2.6, Epoxy Mixing and Handling

 

Benefits of IPC 7711/7721:

It is a set of industry-standard guidelines and procedures for repairing and modifying PCBs and electronic assemblies.

Benefits of J-STD-001

Ensure that rework, modification, and repair processes are performed correctly, which can lead to improved reliability of the resulting work.

Adhering to IPC 7711/7721 guidelines can also help streamline and standardize your rework, modification, and repair processes, which can increase efficiency and reduce the risk of errors.

Help improve the quality of your work, as they provide guidance on how to properly perform rework, modification, and repair processes to meet appropriate standards.

Adhering to IPC 7711/7721 guidelines can help you deliver high-quality work that meets your customers' expectations, which can lead to greater customer satisfaction.

Reduce the risk of liability by demonstrating that you have taken steps to ensure that your work meets appropriate standards for quality and reliability.

IPC 7711/7721
Certification & Recertification :

After completing the course, students will take open book written examinations and be required to perform acceptable rework and repairs based on IPC-7711/7721. A student who successfully completes this Course will receive an IPC 7711/7721 Certified IPC Specialist Certification that remains valid for two years. Those who have already earned their CIS certification within the last two years may take part in a relevant recertification training.

The training is designed to help the students gain a deeper understanding of their field, as well as build upon their prior knowledge and skill sets. The training material includes a review of IPC-7711/7721 and hands-on training with live boards, which allows participants to gain confidence in their abilities.

The course also helps students learn more about the industry standards and best practices associated with the repair and rework of electronic assemblies. Students can gain insight into the various types of components and how they are used in various board assemblies. The interactive exercises during the course also help with troubleshooting issues and understanding why certain procedures are necessary.

IPC 7711/7721 Certificates:

IPC 7711/7721 CIS (Certified IPC Specialist)
IPC 7711/7721 CIT (Certified IPC Trainer)

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