Module 1 – IPC-7711 / 7721C Introduction and Common Procedures (Mandatory)
This compulsory Module contains broad content, which is normally implied to all other section of the IPC-7711/7721C course. To obtain certification to additional knowledge modules, this module must be successful completed before it can be taken.
- Basic skills required to repair and rework circuit boards
- Skill levels needed
- Level of conformance the finished product will need to achieve
- Common terminology used.
Module 2 Workmanship – Wire Splicing
The workmanship of Wire Splicing requires the basic skills this additional knowledge module contains.
- The Process of Wire Splicing
- The Four Most Common Splices Mesh, Wrap, Hook, & Lap
- Feasibility of Repair
- Insulated Conductor Stripping
- Tinning methods
- Soldering
- Procedures 8.1.1 – 8.1.4
- Splice acceptance criteria
Module 3 Workmanship – Conformal Coating
The basic and additional knowledge required for Conformal Coating workmanship is contained in this additional knowledge module.
- Procedure 2.3.1, Coating Removal, Identification of Conformal Coating
- Procedure 2.3.2, Coating Removal, Solvent Method
- Procedure 2.3.3, Coating Removal, Peeling Method
- Procedure 2.3.4, Coating Removal, Thermal Method
- Procedure 2.3.5, Coating Removal, Grinding/Scraping Method
- Procedure 2.3.6, Coating Removal, Micro Blasting Method
- Procedure 2.4.1, Coating Replacement, Solder Resist
- Procedure 2.4.2, Coating Replacement, Conformal Coating/ Encapsulants
- Procedure 2.5, Baking and Preheating
Module 4 Workmanship – Through Hole Components
The basic and additional knowledge required for Through Hole Components workmanship is provided in this additional knowledge module.
- Procedure 3.1.1, Through-Hole Desoldering, Continuous Vacuum
- Procedure 3.1.2, Through-Hold Desoldering, Continuous Vacuum – Partial Clinch
- Procedure 3.1.3, Through-Hole Desoldering, Continuous Vacuum – Full Clinch Procedure
- 1.4, Through-Hole Desoldering, Full Clinch Straightening
- Procedure 3.1.3, Through-Hole Desoldering, Full Clinch Wicking
- Installation of Through-Hole components, Tinning, Lead Forming, Soldering
Module 5 Workmanship – Chip and MELF Components
The basic and additional knowledge required for Chip and MELF Component workmanship is contained in this additional knowledge module.
- Procedure 3.3.1, Chip Component Removal – Bifurcated Tip
- Procedure 3.3.2, Chip Component Removal – Tweezer Method
- Procedure 3.3.3, Chip Component Removal – Hot Air Method
- Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
- Procedure 4.1.3, Surface Solder Removal – Braid Method
- Procedure 5.3.1, Chip Installation – Solder Paste Method/Hot Air Pencil
- Procedure 5.3.2, Chip Installation – Point to Point
Module 6 Workmanship – Gull Wing Lead Components
The basic basic and additional workmanship skills required for making Gull Wing Lead Components are contained in this additional knowledge module.
- Procedure 3.5.1, SOT Removal – Flux Application Method
- Procedure 3.5.2, SOT Removal – Flux Application Method –Tweezer
- Procedure 3.5.3, SOT Removal – Hot Air Pencil
- Procedure 3.6.2, Gull Wing Removal (two-sided) – Solder wrap Method
- Procedure 3.6.6, Gull Wing Removal (two-sided) – Tweezer
- Procedure 3.7.1.1, Gull Wing Removal (four-sided) – Bridge Fill Method – Surface Tension
- Procedure 3.7.7, Gull Wing Removal (four-sided) – Hot Gas
- Procedure 3.7.1, Gull Wing Removal (four-sided) – Bridge Fill Method
- Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
- Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
- Procedure 4.1.3, Surface Solder Removal – Braid Method
- Procedure 4.4.1, Cleaning SMT Lands – Using Blade Tip and Solder Braid
- Procedure 4.2.1, Pad Releveling – Using Blade Tip
- Procedure 4.3.1, SMT Land Tinning – Using the Blade Tip
- Procedure 5.5.1, Gull Wing Installation – Multi-Lead Method – Top of Lead
- Procedure 5.5.3, Gull Wing Installation – Point-to-Point Method
- Procedure 5.5.4, Gull Wing Installation – Hot Air Pencil/Solder Paste Method
Module 7 Workmanship – J-Lead Components
This basic and additional knowledge module provides the foundation skills for the workmanship of J-Lead Components.
- Procedure 3.8.1.1, J-Lead Removal – Bridge Fill Method – Surface Tension
- Procedure 3.8.2, J-Lead Removal – Solder Wrap Method – Tweezer
- Procedure 3.8.3, J-Lead Removal Flux Application Method – Tweezer
- Procedure 3.8.4, J-Lead Removal – Flux & Tin Tip Only
- Procedure 3.8.5, J-Lead Removal – Hot Gas Reflow System
- Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
- Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
- Procedure 4.1.3, Surface Solder Removal, Braid Method
- Procedure 5.6.1, J-Lead Installation – Solder Wire Method
- Procedure 5.6.2, J-Lead Installation – Point-to-Point
- Procedure 5.6.3, J-Lead Installation – Solder Paste/Hot Air
Module 9 Workmanship – Laminate Repair
The basic and additional skills required for Laminate Repair are contained in this additional knowledge module.
- Procedure 3.3.1, Hole Repair, Epoxy Method
- Procedure 3.3.2 Hole Repair, Transplant Method
- Procedure 3.5.1, Base Material Repair, Epoxy Method
- Procedure 2.6, Epoxy Mixing and Handling
Module 10 Workmanship – Circuit Repair
The basic and additional knowledge module provides the necessary knowledge for Circuit Repair workmanship.
- Procedure 4.2.1, Conductor Repair, Foil Jumper Epoxy Method
- Procedure 4.2.2, Conductor Repair, Foil Jumper, Film Adhesive Method
- Procedure 4.7.1, Surface Mount Pad Repair, Epoxy Method
- Procedure 5.1, Plated Hole Repair, No Inner Layer Connection
- Procedure 6.1, Jumper Wires
- Procedure 2.6, Epoxy Mixing and Handling