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IPC 7711 7721

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IPC 7711/7721 is a set of industry-standard guidelines for the repair and rework of electronic assemblies. The guidelines are published by the IPC, that develops industry standards and best practices for the manufacture and design of electronic products.

Both IPC 7711 and IPC 7721 are widely used in the electronics industry as a reference for repairing and reworking electronic assemblies and PCBAs. They are designed to help ensure that repair and rework processes are carried out in a consistent and reliable manner, resulting in high-quality electronic products.

CERTIFICATION IPC 7711/7721 CERTIFIED IPC TRAINER (CIT)

The IPC Certified Trainer Program provides training courses to ensure that those who want to become certified as instructors for various electronic assembly standards can do so. The IPC-7711/7721 is the electronic industry’s most widely accepted standard for removing and replacing electronic components and repairing circuitry. This includes both surface mount rework and repair, as well as conventional boards.

The IPC rework, repair, and modification course is a comprehensive five-day program which teaches advanced techniques for craftsmanship reworking, fixing, and modifying accepted workmanship samples. It is designed for quality and reliability officers who handle rework and repair operations in their organization.

 

The training courses are designed to help those seeking certification to understand the IPC-7711/7721 standard and how to use it to effectively rework, repair, and modify accordingly. Moreover, the courses will demonstrate how to reference the appropriate sections of the standard in order to properly document procedures that were used.

 

Furthermore, the courses will emphasize common mistakes made during rework and repair operations and how to avoid them. It also covers topics such as safety measures that must be taken when handling soldering equipment, safely working with components on circuit boards, and proper soldering techniques.

What is IPC 7711/7721?

The IPC 7711/7721 standard covers a wide range of topics related to PCB repair and modification, including techniques for repairing damaged PCBs, procedures for modifying PCBs to correct design errors or improve performance, and guidelines for testing and evaluating repaired and modified PCBs.


The standard also provides guidance on the use of specialized tools and equipment, as well as the selection and use of materials and processes for repair and modification.


IPC 7711/7721 is widely used in the electronics industry and is considered an essential reference for technicians, engineers, and others involved in the repair and modification of PCBs and electronic assemblies. It is regularly updated to ensure that it reflects the latest best practices and technologies in the industry.

Curriculum:

Module 1 – IPC-7711 / 7721C Introduction and Common Procedures

This compulsory Module contains broad content, which is normally implied to all other section of the IPC-7711/7721C course. To obtain certification to additional knowledge modules, this module must be successful completed before it can be taken.

  • Basic skills required to repair and rework circuit boards
  • Skill levels needed
  • Level of conformance the finished product will need to achieve
  • Common terminology used.

Module 2 Workmanship – Wire Splicing

The workmanship of Wire Splicing requires the basic skills this additional knowledge module contains.

  • The Process of Wire Splicing
  • The Four Most Common Splices Mesh, Wrap, Hook, & Lap
  • Feasibility of Repair
  • Insulated Conductor Stripping
  • Tinning methods
  • Soldering
  • Procedures 8.1.1 – 8.1.4
  • Splice acceptance criteria

Module 3 Workmanship – Conformal Coating

The basic and additional knowledge required for Conformal Coating workmanship is contained in this additional knowledge module.

  • Procedure 2.3.1, Coating Removal, Identification of Conformal Coating
  • Procedure 2.3.2, Coating Removal, Solvent Method
  • Procedure 2.3.3, Coating Removal, Peeling Method
  • Procedure 2.3.4, Coating Removal, Thermal Method
  • Procedure 2.3.5, Coating Removal, Grinding/Scraping Method
  • Procedure 2.3.6, Coating Removal, Micro Blasting Method
  • Procedure 2.4.1, Coating Replacement, Solder Resist
  • Procedure 2.4.2, Coating Replacement, Conformal Coating/ Encapsulants
  • Procedure 2.5, Baking and Preheating

Module 4 Workmanship – Through Hole Components

The basic and additional knowledge required for Through Hole Components workmanship is provided in this additional knowledge module.

  • Procedure 3.1.1, Through-Hole Desoldering, Continuous Vacuum
  • Procedure 3.1.2, Through-Hold Desoldering, Continuous Vacuum – Partial Clinch
  • Procedure 3.1.3, Through-Hole Desoldering, Continuous Vacuum – Full Clinch Procedure
  • 1.4, Through-Hole Desoldering, Full Clinch Straightening
  • Procedure 3.1.3, Through-Hole Desoldering, Full Clinch Wicking
  • Installation of Through-Hole components, Tinning, Lead Forming, Soldering

Module 5 Workmanship – Chip and MELF Components

The basic and additional knowledge required for Chip and MELF Component workmanship is contained in this additional knowledge module.

  • Procedure 3.3.1, Chip Component Removal – Bifurcated Tip
  • Procedure 3.3.2, Chip Component Removal – Tweezer Method
  • Procedure 3.3.3, Chip Component Removal – Hot Air Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 5.3.1, Chip Installation – Solder Paste Method/Hot Air Pencil
  • Procedure 5.3.2, Chip Installation – Point to Point

Module 6 Workmanship – Gull Wing Lead Components

The basic basic and additional workmanship skills required for making Gull Wing Lead Components are contained in this additional knowledge module.

  • Procedure 3.5.1, SOT Removal – Flux Application Method
  • Procedure 3.5.2, SOT Removal – Flux Application Method –Tweezer
  • Procedure 3.5.3, SOT Removal – Hot Air Pencil
  • Procedure 3.6.2, Gull Wing Removal (two-sided) – Solder wrap Method
  • Procedure 3.6.6, Gull Wing Removal (two-sided) – Tweezer
  • Procedure 3.7.1.1, Gull Wing Removal (four-sided) – Bridge Fill Method – Surface Tension
  • Procedure 3.7.7, Gull Wing Removal (four-sided) – Hot Gas
  • Procedure 3.7.1, Gull Wing Removal (four-sided) – Bridge Fill Method
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal – Braid Method
  • Procedure 4.4.1, Cleaning SMT Lands – Using Blade Tip and Solder Braid
  • Procedure 4.2.1, Pad Releveling – Using Blade Tip
  • Procedure 4.3.1, SMT Land Tinning – Using the Blade Tip
  • Procedure 5.5.1, Gull Wing Installation – Multi-Lead Method – Top of Lead
  • Procedure 5.5.3, Gull Wing Installation – Point-to-Point Method
  • Procedure 5.5.4, Gull Wing Installation – Hot Air Pencil/Solder Paste Method

Module 7 Workmanship – J-Lead Components

This basic and additional knowledge module provides the foundation skills for the workmanship of J-Lead Components.

  • Procedure 3.8.1.1, J-Lead Removal – Bridge Fill Method – Surface Tension
  • Procedure 3.8.2, J-Lead Removal – Solder Wrap Method – Tweezer
  • Procedure 3.8.3, J-Lead Removal Flux Application Method – Tweezer
  • Procedure 3.8.4, J-Lead Removal – Flux & Tin Tip Only
  • Procedure 3.8.5, J-Lead Removal – Hot Gas Reflow System
  • Procedure 4.1.1, Surface Mount Land Preparation – Individual Method
  • Procedure 4.1.2, Surface Mount Land Preparation – Continuous Method
  • Procedure 4.1.3, Surface Solder Removal, Braid Method
  • Procedure 5.6.1, J-Lead Installation – Solder Wire Method
  • Procedure 5.6.2, J-Lead Installation – Point-to-Point
  • Procedure 5.6.3, J-Lead Installation – Solder Paste/Hot Air

Module 9 Workmanship – Laminate Repair

The basic and additional skills required for Laminate Repair are contained in this additional knowledge module.

  • Procedure 3.3.1, Hole Repair, Epoxy Method
  • Procedure 3.3.2 Hole Repair, Transplant Method
  • Procedure 3.5.1, Base Material Repair, Epoxy Method
  • Procedure 2.6, Epoxy Mixing and Handling

Module 10 Workmanship – Circuit Repair

The basic and additional knowledge module provides the necessary knowledge for Circuit Repair workmanship.

  • Procedure 4.2.1, Conductor Repair, Foil Jumper Epoxy Method
  • Procedure 4.2.2, Conductor Repair, Foil Jumper, Film Adhesive Method
  • Procedure 4.7.1, Surface Mount Pad Repair, Epoxy Method
  • Procedure 5.1, Plated Hole Repair, No Inner Layer Connection
  • Procedure 6.1, Jumper Wires
  • Procedure 2.6, Epoxy Mixing and Handling

Benefits of IPC 7711/7721:

It is a set of industry-standard guidelines and procedures for repairing and modifying PCBs and electronic assemblies.

Benefits of J-STD-001

Ensure that rework, modification, and repair processes are performed correctly, which can lead to improved reliability of the resulting work.

Adhering to IPC 7711/7721 guidelines can also help streamline and standardize your rework, modification, and repair processes, which can increase efficiency and reduce the risk of errors.

Help improve the quality of your work, as they provide guidance on how to properly perform rework, modification, and repair processes to meet appropriate standards.

Adhering to IPC 7711/7721 guidelines can help you deliver high-quality work that meets your customers' expectations, which can lead to greater customer satisfaction.

Reduce the risk of liability by demonstrating that you have taken steps to ensure that your work meets appropriate standards for quality and reliability.

IPC 7711/7721
Certification & Recertification :

After completing the course, students will take open book written examinations and be required to perform acceptable rework and repairs based on IPC-7711/7721. A student who successfully completes this Course will receive an IPC 7711/7721 Certified IPC Trainer Certification that remains valid for two years. Those who have already earned their CIT certification within the last two years may take part in a relevant recertification training.

After the completion of the course, students will be evaluated through an open book written examination. Upon successful completion, they will receive an IPC 7711/7721 Certified IPC Trainer Certification that is valid for two years. For those who have previously earned their CIT certification within the last two years, they may opt to go through a relevant recertification training to maintain its validity. Such training is designed to provide a comprehensive understanding of the latest technology and industry developments related to this field.

The course also helps students learn more about the industry standards and best practices associated with the repair and rework of electronic assemblies. Students can gain insight into the various types of components and how they are used in various board assemblies. The interactive exercises during the course also help with troubleshooting issues and understanding why certain procedures are necessary.

IPC 7711/7721 Certificates:

IPC 7711/7721 CIS (Certified IPC Specialist)
IPC 7711/7721 CIT (Certified IPC Trainer)

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